A-Failure of electronic components-Packaging failures-pcb

- Feb 06, 2017-

A-Failure of electronic components-

Packaging failures-pcb

Packaging failures

The majority of electronic parts failures are packaging-related. Packaging, as the barrier between electronic parts and the environment, is very susceptible to environmental factors. Thermal expansion produces mechanical stresses that may cause material fatigue, especially when the thermal expansion coefficients of the materials are different. Humidity and aggressive chemicals can cause corrosion of the packaging materials and leads, potentially breaking them and damaging the inside parts, leading to electrical failure. Exceeding the allowed environmental temperature range can cause overstressing of wire bonds, thus tearing the connections loose, cracking the semiconductor dies, or causing packaging cracks. Humidity and subsequent high temperature heating may also cause cracking, as may mechanical damage or shock.

During encapsulation, bonding wires can be severed, shorted, or touch the chip die, usually at the edge. Dies can crack due to mechanical overstress or thermal shock; defects introduced during processing, like scribing, can develop into fractures. Lead frames may contain excessive material or burrs, causing shorts. Ionic contaminants like alkali metals and halogens can migrate from the packaging materials to the semiconductor dies, causing corrosion or parameter deterioration. Glass-metal seals commonly fail by forming radial cracks that originate at the pin-glass interface and permeate outwards; other causes include a weak oxide layer on the interface and poor formation of a glass meniscus around the pin.


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