A Rework (electronics) Process Reflowing and
Reflowing and reballing
Reflowing as a rework technique, similar to the manufacturing process of reflow soldering, involves dismantling the equipment to remove the faulty circuit board, pre-heating the whole board in an oven, heating the non-functioning component further to melt the solder, then cooling, following a carefully determined thermal profile, and reassembling, a process which is hoped will repair the bad connection without the need to remove and replace the component. This may or not resolve the problem; and there is a chance that the reflowed board will fail again after some time. For typical devices (PlayStation 3 and Xbox 360) one repair company estimates that the process, if there are no unexpected problems, takes about 80 minutes. On a forum where professional repair people discuss reflowing of laptop computer graphics chips, different contributors cite success rates (no failure within 6 months) of between 60 and 90% for reflowing with professional equipment and techniques, in equipment whose value does not justify complete reballing. Reflowing can done non-professionally in a domestic oven or with a heat gun. While such methods can cure some problems, the outcome is likely to be less successful than is possible with accurate thermal profiling achieved by an experienced technician using professional equipment.