Ball grid array-Disadvantages-Difficulties with BGAs during circuit developmen

- Jan 07, 2017-

Ball grid array-Disadvantages-Difficulties

with BGAs during circuit developmen


Difficulties with BGAs during circuit development

During development it is not practical to solder BGAs into place, and sockets are used instead, but tend to be unreliable. There are two common types of socket: the more reliable type has spring pins that push up under the balls, although it does not allow using BGAs with the balls removed as the spring pins may be too short.

The less reliable type is a ZIF socket, with spring pinchers that grab the balls. This does not work well, especially if the balls are small.

Cost of equipment

Expensive equipment is required to reliably solder BGA packages; hand-soldering BGA packages is very difficult and unreliable, usable only for the smallest packages in the smallest quantities. However, as more ICs have become available only in leadless (e.g. quad-flat no-leads package) or BGA packages, various DIY reflow methods have been developed using inexpensive heat sources such as heat guns, and domestic toaster ovens and electric skillets.

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