China's two specifications for lead-free printed circuit substrates formally become IEC standards
Summary of content: Recently, the International Electrotechnical Commission (IEC) officially released two international standards: "IEC 61249-2-41 Ed.1 for flammable brominated epoxy cellulose paper / E fiberglass for lead-free assembly. Specification for cloth-clad copper foil laminates "and" IEC 61249-2-24 "Ed.1 Specification for brominated epoxy E glass fiber paper / E glass fiber cloth copper-clad laminates with limited flammability for lead-free assembly" . The proposals for the establishment of these two standards were submitted by the Substrate Working Group of the National Printed Circuit Standardization Technical Committee to the IEC / TC91 Electronic Assembly Technical Committee in September 2006. The Institute of Electronic Industry Standardization of the Ministry of Industry and Information Technology and Guangdong Shengyi Many experts from the Technology Co., Ltd. and other units undertook the preparation work.
The EU's RoHS directive stipulates that from July 1, 2006, electronic information products that are newly put on the market must ban lead (Pb), mercury (Hg), cadmium (Cd), hexavalent chromium (Cr + 6), polybrominated biphenyls (PBB ) And six kinds of harmful substances such as polybrominated diphenyl ether (PBDE). The “Administrative Measures for the Control of Pollution Caused by Electronic Information Products” (Ministry of Information Industry No. 39) issued by the former Ministry of Information Industry of China in 2006 stipulates that from March 1, 2007, the process of producing, selling and importing electronic information products in China It must not contain the six banned substances stipulated by the EU RoHS directive and other toxic and harmful substances or elements stipulated by the state. This means that traditional leaded solder will be replaced by lead-free solder, and the global electronics industry has entered a lead-free era. The current representative lead-free solder has a melting point above 216 ° C, while the traditional leaded solder (such as Sn63 / Pb37) has a melting point of 183 ° C. Lead-free solder is 30 ° C to 40 ° C higher than the soldering temperature of traditional solders. Therefore, it is a general trend to develop and produce copper-clad laminate products that can withstand the high temperatures of lead-free soldering. Zh
The release of the above two specifications for copper-clad laminates suitable for lead-free soldering has solidified the research and development achievements and independent intellectual property rights of the printed circuit industry in China, which will greatly improve China's international market competitiveness in this product field and achieve the standard. The committee organizes the objective of enterprises' substantial participation in the formulation of international standards. The issuance, implementation and application of these two specifications reflect China's breakthrough international progress in technical standards in this field, and highlight the enhancement of standard innovation capabilities in this field.