Desoldering and resoldering-Custom Design
Circuit Board Pcb
The solderability of a substrate is a measure of the ease with which a soldered joint can be made to that material.
Desoldering and resoldering
Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints. Once the solder's capacity for the base metal has been achieved it will no longer properly bond with the base metal, usually resulting in a brittle cold solder joint with a crystalline appearance.
It is good practice to remove solder from a joint prior to resoldering—desoldering braids or vacuum desoldering equipment (solder suckers) can be used. Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present. This will leave a bright, shiny, clean junction to be resoldered.
The lower melting point of solder means it can be melted away from the base metal, leaving it mostly intact, though the outer layer will be "tinned" with solder. Flux will remain which can easily be removed by abrasive or chemical processes. This tinned layer will allow solder to flow into a new joint, resulting in a new joint, as well as making the new solder flow very quickly and easily.