Flexible Electronics-Flexible circuit

materials-Bonding adhesive

Flexible circuit materials

Bonding adhesive

Adhesives are used as the bonding medium for creating a laminate. When it comes to temperature resistance, the adhesive is typically the performance limiting element of a laminate especially when polyimide is the base material. Because of the earlier difficulties associated with polyimide adhesives, many polyimide flex circuits presently employ adhesive systems of different polymer families. However some newer thermoplastic polyimide adhesives are making important in-roads. As with the base films, adhesives come in different thickness. Thickness selection is typically a function of the application. For example, different adhesive thickness is commonly used in the creation of cover layers in order to meet the fill demands of different copper foil thickness which may be encountered.