Method for improving the efficiency of SMT chip processing

- Sep 27, 2019-

Method for improving the efficiency of SMT chip processing

Nowadays, the market competition is becoming more and more fierce. In order to be in an invincible position in such an environment, the first thing to do is to reduce the production cost. To achieve this goal, the main method is to improve the production efficiency of the production line. Shenzhen SMT SMT processing company based on its own experience to explore some measures and methods to improve the efficiency of SMT chip processing production line.

1, the placement process processing

The SMT production line consists of multiple machines, including screen printing machines, placement machines, reflow soldering, etc., but the speed of the production line is determined by the placement machine. An SMT line usually consists of a high-speed machine and a high-precision placement machine. The former mainly mounts chip components, while the latter mainly mounts ICs and profiled components. When the time for the two placement machines to complete a placement process (hereinafter referred to as the placement time) is equal and small, the entire SMT production line has a large production capacity. In order to achieve this goal, we can handle the placement process as follows.

Load distribution balance. Reasonably allocate the number of components to be placed on each device, and try to make the placement time of each device equal. When we first allocate the number of components for each device, there is often a large gap in placement time. This requires adjustment of the production load of all devices on the production line according to the placement time of each device. Some components on the longer device are moved to another device to achieve load sharing balance.

Equipment optimization. Each placement machine has a large patch speed value, such as YAMAHA's YV100 0.25 sec/chip, but in fact this speed value is to be achieved under certain conditions. The optimization of the NC program of each device is to make the placement machine meet these conditions as much as possible in the production process, thereby achieving high-speed placement and reducing the mounting time of the device. The principle of optimization depends on the structure of the device. For the X/Y structure of the placement machine, it is usually optimized according to the following principles.

2, as far as possible, the placement head picks up components at the same time

When arranging the placement program, the same type of components are arranged together to reduce the number of times the nozzle is changed when the head picks up the component, thereby saving the mounting time. Feeders with a high number of pick-ups should be placed close to the station on the printed board. During a pick-and-place cycle, try to reclaim only from the front or back of the station to reduce the distance the placement head moves. The placement head is fully loaded during each pick and place cycle.

Some principles conflict when optimizing the program, which requires a compromise to select a good optimization solution. Optimized software is available for load distribution and equipment optimization, and the optimization software includes equipment optimization programs and line balancing software. The device optimization program is optimized for the placement program and feeder configuration. After obtaining the BOM and CAD data of the component, the placement program and the feeder configuration table can be generated. The optimization program optimizes the movement path of the placement head and the configuration of the feeder to minimize the placement head. Move the distance to save placement time. The production line balancing software is an effective tool for optimizing the entire production line. The optimization software adopts certain optimization algorithms. The current optimization software has certain intelligence, and the optimization process can be completed quickly and well.

The SMT chip processing production line is composed of multiple automation equipment. When the speed of one equipment is slower than other equipment, then this equipment will become the bottleneck restricting the speed of the entire SMT production line. According to the sampling of 19 factories, the general bottleneck often appears on the placement machine. To eliminate the bottleneck, it can only be achieved by adding a placement machine. Of course, this requires a large capital investment, but this can make full use of the excess capacity of other equipment, far more cost-effective than investing in an SMT production line. What type of placement machine is added depends on the bottleneck of the production line. In general, a high-speed, multi-functional placement machine is purchased, because it combines the characteristics of high-speed machine and high-precision machine, and the components are mounted. The range covers high-precision machines and high-speed machines, which can solve bottleneck problems caused by high-speed machines or high-precision machines. At present, the development trend of the placement machine is also developing in this direction to meet the needs of the market.

The above is the industry consultation provided by smt patch processing factory Shenzhen Pengzexiang Technology Co., Ltd., I hope to help you! Please contact us if necessary: http://www.oem-pcb.com pcb@sunsoartech.com

 


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