Microvia reliability-printed circuit board

- Mar 02, 2017-

Microvia reliability-printed circuit board

Microvia reliability

The reliability of HDI structure is one of the major constraints for its successful widespread implementation in the PCB industry. Good thermo-mechanical reliability of microvias is an essential part of HDI reliability. Many researchers and professionals have studied the reliability of microvas in HDI PCBs. The reliability of microvas depends on many factors such as microvia geometry parameters, dielectric material properties, and processing parameters.

Microvia reliability research has focused on experimental assessment of the reliability of single-level unfilled microvias, as well as finite element analysis on stress/strain distributions in single-level microvias and microvia fatigue life estimation. Microvia failures identified from the research include interfacial separation (separation between the base of the microvia and the target pad), barrel cracks, corner/knee cracks, and target pad cracks (also referred to as microvia pull out). These failures result from the thermomechanical stresses caused by coefficient of thermal expansion (CTE) mismatch, in the PCB thickness direction, between the metallization in a microvia structure and the dielectric materials surrounding the metal. The following paragraph highlights some of the microvia reliability research.

Ogunjimi et al. looked at the effect of manufacturing and design process variables on the fatigue life of microvias, including trace(conductor) thickness, layer or layers of the dielectric around the trace and in the microvia, via geometry, via wall angel, ductility coefficient of the conductor material, and strain concentration factor. Finite element models were created with different geometries, and ANOVA method was used to determine the significance of the different process variables. The ANOVA results showed that the strain concentration factor was the most important variable, followed with the ductility factor, metallization thickness, and via wall angle. Prabhu et al. conducted a finite element analysis (FEA) on an HDI microvia structure to determine the effect of accelerated temperature cycling and thermal shock. Liu et al. and Ramakrishna et al. conducted liquid-to-liquid and air-to-air thermal shock testing, respectively, to studied the effect of dielectric material properties and microvia geometry parameters, such as microvia diameter, wall angle and plating thickness, on microvia reliability. Andrews et al. investigated single-level microvia reliability using IST (interconnect stress test), and considered the effect of reflow cycles of lead-free solder. Wang and Lai investigated the potential failure sites of microvias using finite element modeling. They found that filled microvias have a lower stress than unfilled microvias. Choi and Dasgupta introduced microvia non-destructive inspection method in their work.

Although most microvia reliability research focuses on single-level microvias, Birch tested multiple-level stacked and staggered microvias using IST test. Weibull analysis on the test data showed that single- and 2-level stacked microvias last longer than 3- and 4-level microvias (e. g. 2-level stacked microvias experienced about 20 times more cycles to failure than 4-level stacked microvias).

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