Multi-chip module-Chip stack MCMs-Design
Circuit Board Electronic Pcb
Chip stack MCMs
A relatively new development in MCM technology is the so-called "chip-stack" package. Certain ICs, memories in particular, have very similar or identical pinouts when used multiple times within systems. A carefully designed substrate can allow these dies to be stacked in a vertical configuration making the resultant MCM's footprint much smaller (albeit at the cost of a thicker or taller chip). Since area is more often at a premium in miniature electronics designs, the chip-stack is an attractive option in many applications such as cell phones and personal digital assistants (PDAs). After a thinning process, as many as ten dies can be stacked to create a high capacity SD memory card.
Examples of MCM technologies
IBM Bubble memory MCMs (1970s)
IBM 3081 mainframe's thermal conduction module (1980s)
Intel Pentium Pro, Pentium D Presler , Xeon Dempsey and Clovertown, Core 2 Quad (Kentsfield and Yorkfield), Clarkdale, Arrandale, and Haswell-H
Sony memory sticks
Xenos, a GPU designed by ATI Technologies for the Xbox 360, with eDRAM
POWER2, POWER4, POWER5 and POWER7 from IBM
z196 from IBM
AMD processors for Socket G34
Nintendo's Wii U has its CPU, GPU, and onboard VRAM (integrated into the GPU) on one MCM.
Flash and RAM memory combined on a PoP by Micron