Power electronic substrate-Custom Design
Circuit Board Electronic Pcb
Power electronic substrate
From Wikipedia, the free encyclopedia
The role of the substrate in power electronics is to provide the interconnections to form an electric circuit (like a printed circuit board), and to cool the components. Compared to materials and techniques used in lower power microelectronics, these substrates must carry higher currents and provide a higher voltage isolation (up to several thousand volts). They also must operate over a wide temperature range (up to 150 or 200 °C).
Active metal brazed substrate
Another technology to attach thick metal layers to ceramic plates is the AMB (active metal braze) technology. With this process a metal foil is soldered to the ceramic using als[clarification needed] solder paste and high temperature (800 °C – 1000 °C). The process itself requires vacuum. Therefore, though AMB is electrically very similar to DBC, it is only suited for small production lots.