Printed circuit assemblies-Circuit Board
Hermetic ceramic packages
Packages consisting of a lead frame embedded in a vitreous paste layer between flat ceramic top and bottom covers are more convenient than metal/glass packages for some products, but give equivalent performance. Examples are integrated circuit chips in ceramic Dual In-line Package form, or complex hybrid assemblies of chip components on a ceramic base plate. This type of packaging can also be divided into two main types: multilayer ceramic packages (like LTCC and HTCC) and pressed ceramic packages.
Printed circuit assemblies
Printed circuits are primarily a technology for connecting components together, but they also provide mechanical structure. In some products, such as computer accessory boards, they're all the structure there is. This makes them part of the universe of electronic packaging.
An engineer or designer must balance many objectives and practical considerations when selecting packaging methods.
Hazards to be protected against: mechanical damage, exposure to weather and dirt, electromagnetic interference, etc.
Heat dissipation requirements
Tradeoffs between tooling capital cost and per-unit cost
Tradeoffs between time to first delivery and production rate
Availability and capability of suppliers
User interface design and convenience
Ease of access to internal parts when required for maintenance
Product safety, and compliance with regulatory standards
Aesthetics, and other marketing considerations
Service life and reliability
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