Wave solder process Fluxing Preheating Printed
Wave solder process
There are many types of wave solder machines; however, the basic components and principles of these machines are the same. The basic equipment used during the process is a conveyor that moves the PCB through the different zones, a pan of solder used in the soldering process, a pump that produces the actual wave, the sprayer for the flux and the preheating pad. The solder is usually a mixture of metals. A typical solder has the chemical makeup of 50% tin, 49.5% lead, and 0.5% antimony.
Flux in the wave soldering process has a primary and a secondary objective. The primary objective is to clean the components that are to be soldered, principally any oxide layers that may have formed. There are two types of flux, corrosive and noncorrosive. Noncorrosive flux requires precleaning and is used when low acidity is required. Corrosive flux is quick and requires little precleaning, but has a higher acidity.
Preheating helps to accelerate the soldering process and to prevent thermal shock.