Wave soldering Cleaning Solder types Printed
Some types of flux, called "no-clean" fluxes, do not require cleaning; their residues are benign after the soldering process. Typically no-clean fluxes are especially sensitive to process conditions, which may make them undesirable in some applications. Other kinds of flux, however, require a cleaning stage, in which the PCB is washed with solvents and/or deionized water to remove flux residue.
Different combinations of tin, lead and other metals are used to create solder. The combinations used depend on the desired properties. The most popular combinations are SAC (Tin(Sn)/Silver(Ag)/Copper(Cu)) alloys and Sn63Pb37 (Sn63A) which is 63% tin, 37% lead. The latter combination is strong, has a low melting range, and melts and sets quickly. Higher tin compositions give the solder higher corrosion resistances, but raise the melting point. Another common composition is 11% tin, 37% lead, 42% bismuth, and 10% cadmium. This combination has a low melting point and is useful for soldering components that are sensitive to heat. Environmental and performance requirements also factor into alloy selection. Common restrictions include restrictions on lead (Pb) when RoHS compliance is required and restrictions on pure tin (Sn) when long term reliability is a concern.