What are the details that must be paid attention to during SMT patch processing?
Inside each production plant, there will be an SMT chip processing line. On this line, we can divide into the following sections.
1. Lead-free solder paste printing machine
In this part, the machine we use is the SMT semi-automatic printing machine. In this operation, we should pay attention to the stencil and PCB sections, the steel mesh and the PCB pads must be completely coincident, and after three tests, it is determined that normal production begins. After printing each PCB, it must be self-tested. Solder paste printing does not allow many tin bars, tin, even tin, migration and other undesirable phenomena. Printing defective products should be carefully cleaned. Wipe the wire mesh in time. Timely replenishment to ensure the amount of stencil rolling of the solder paste.
2. Mounting of small materials
The machine we use in this process is a CP machine. Quickly install materials. Before starting, the work that needs to be done, such as the placement of materials, the positioning of the machine, should be prepared to fill the material when the yellow light of the machine is on.
3. Mounting of large materials
This process is designed to help large materials in the PCB to be added to the CP machine that cannot be installed, such as before the crystal. In this link, we used the XP machine. It can achieve huge automatic installation of materials. The notification process is similar to the CP.
4, before the furnace QC
This link is an important part of the overall SMT process. This process ensures that all semi-finished products are completely problem-free in the furnace, so called the QC of the furnace. This post is usually used in QC to check the exhaustion of the machine from the PCB board. To see if there are any problems with leaks, some materials, etc. Then, manually correct the leak or part of the material.
5, reflow soldering
Its function is to reflow the solder paste into a layout so that the material is soldered to the plate. This process requires the machine to be wave soldered. Wave soldering should point out that there are several points. The first is the temperature adjustment in the furnace, which needs to take into account the degree of heat resistance of the heat and material in the PCB board, and then will set the optimum temperature so that the PCB board is basically no problem after the furnace.
6, after the furnace QC
Quality is the life. In the furnace, there are certain problems, such as air welding, welds, welding, etc. So how do you find these problems? We must be in this link also with the past QC, the problem of testing after the furnace plate. Then manually modify it.
7, QA sampling
When all the automatic post-assembly processes disappear, we have the final step, which is sampling. This step of sampling can roughly calculate the production of our products, the pass rate, which is the quality. Of course, sampling must be done carefully every step, do not miss the layout of each detail, thus ensuring the quality of the company's products.
Final storage. Storage also needs to pay attention to packaging, not sloppy. This can provide a perfect experience for customers.
The above is the industry consultation provided by smt patch processing factory Shenzhen Pengzexiang Technology Co., Ltd., I hope to help you! Please contact us if necessary: http://www.oem-pcb.com firstname.lastname@example.org