3-Thick Film Technology-Separation Of

Elements-Integration Of Devices-pcb

Mounting of capacitors semiconductors

The development of the SMD process actually evolves from the thick film process. Also mounting of naked dies (the actual silicon chip without encapsulation) and wire bonding is a standard process, this provides the basis for minituarization of the circuits as all the extra encapsulation is not necessary.

Separation of elements

This step is often necessary because many components are produced on one substrate at the same time. Thus, some means of separating the components from each other is required. This step may be achieved by wafer dicing.

Integration of devices

At this stage the devices may require integrating with other electronic components, usually in the form of a printed circuit board. This may be achieved by wire bonding or soldering.