A-Microvia-Microvia Reliability-Custom Design
Circuit Board Electronic Pcb
The reliability of HDI structure is one of the major constraints for its successful widespread implementation in the PCB industry. Good thermo-mechanical reliability of microvias is an essential part of HDI reliability. Many researchers and professionals have studied the reliability of microvas in HDI PCBs. The reliability of microvas depends on many factors such as microvia geometry parameters, dielectric material properties, and processing parameters.
Microvia reliability research has focused on experimental assessment of the reliability of single-level unfilled microvias, as well as finite element analysis on stress/strain distributions in single-level microvias and microvia fatigue life estimation. Microvia failures identified from the research include interfacial separation (separation between the base of the microvia and the target pad), barrel cracks, corner/knee cracks, and target pad cracks (also referred to as microvia pull out). These failures result from the thermomechanical stresses caused by coefficient of thermal expansion (CTE) mismatch, in the PCB thickness direction, between the metallization in a microvia structure and the dielectric materials surrounding the metal. The following paragraph highlights some of the microvia reliability research.