B-Hybrid Integrated Circuit Printed Circuit Board

- Mar 29, 2017-

B-Hybrid Integrated Circuit Printed Circuit


Hybrid integrated circuit

Thick film technology is often used as the interconnecting medium for hybrid integrated circuits. The use of screen printed thick film interconnect provides advantages of versatility over thin film although feature sizes may be larger and deposited resistors wider in tolerance. Multi-layer thick film is a technique for further improvements in integration using a screen printed insulating dielectric to ensure connections between layers are made only where required. One key advantage for the circuit designer is complete freedom in the choice of resistor value in thick film technology. Planar resistors are also screen printed and included in the thick film interconnect design. The composition and dimensions of resistors can be selected to provide desired values. The final resistor value is determined by design and can be adjusted by laser trimming. Once the hybrid circuit is fully populated with components, fine tuning prior to final test may be achieved by active laser trimming.

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