B-Printing technologies-Custom Design Circuit
Board Electronic Pcb
Evaporation printing uses a combination of high precision screen printing with material vaporization to print features to 5 µm. This method uses techniques such as thermal, e-beam, sputter and other traditional production technologies to deposit materials through a high precision shadow mask (or stencil) that is registered to the substrate to better than 1 micrometer. By layering different mask designs and/or adjusting materials, reliable, cost-effective circuits can be built additively, without the use of photolithography.
Other methods with similarities to printing, among them microcontact printing and nano-imprint lithography are of interest. Here, µm- and nm-sized layers, respectively, are prepared by methods similar to stamping with soft and hard forms, respectively. Often the actual structures are prepared subtractively, e.g. by deposition of etch masks or by lift-off processes. For example, electrodes for OFETs can be prepared. Sporadically pad printing is used in a similar manner. Occasionally so-called transfer methods, where solid layers are transferred from a carrier to the substrate, are considered printed electronics. Electrophotography is currently not used in printed electronics.
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