Circuit Board Electronic Pcb-Breadboard-High
Frequencies And Dead Bugs
High frequencies and dead bugs
For high-frequency development, a metal breadboard affords a desirable solderable ground plane, often an unetched piece of printed circuit board; integrated circuits are sometimes stuck upside down to the breadboard and soldered to directly, a technique sometimes called "dead bug" construction because of its appearance. Examples of dead bug with ground plane construction are illustrated in a Linear Technologies application note. For other uses of this technique see Dead Bug.
Due to relatively large parasitic capacitance compared to a properly laid out PCB (approx 2pF between adjacent contact columns), high inductance of some connections and a relatively high and not very reproducible contact resistance, solderless breadboards are limited to operation at relatively low frequencies, usually less than 10 MHz, depending on the nature of the circuit. The relatively high contact resistance can already be a problem for some DC and very low frequency circuits. Solderless breadboards are further limited by their voltage and current ratings.
Solderless breadboards usually cannot accommodate surface-mount technology devices (SMD) or components with grid spacing other than 0.1 in (2.54 mm). Further, they cannot accommodate components with multiple rows of connectors if these connectors do not match the dual in-line layout—it is impossible to provide the correct electrical connectivity. Sometimes small PCB adapters called "breakout adapters" can be used to fit the component to the board. Such adapters carry one or more components and have 0.1 in (2.54 mm) spaced male connector pins in a single in-line or dual in-line layout, for insertion into a solderless breadboard. Larger components are usually plugged into a socket on the adapter, while smaller components (e.g., SMD resistors) are usually soldered directly onto the adapter. The adapter is then plugged into the breadboard via the 0.1 in (2.54 mm) connectors. However, the need to solder the components onto the adapter negates some of the advantage of using a solderless breadboard.
Very complex circuits can become unmanageable on a solderless breadboard due to the large amount of wiring required. The very convenience of easy plugging and unplugging of connections also makes it too easy to accidentally disturb a connection, and the system becomes unreliable. It is possible to prototype systems with thousands of connecting points, but great care must be taken in careful assembly, and such a system becomes unreliable as contact resistance develops over time. At some point, very complex systems must be implemented in a more reliable interconnection technology, to have a likelihood of working over a usable time period.
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