Dual In-line Package-Applications-circuit Board Pcb

- Feb 17, 2017-

Dual In-line Package-Applications-circuit

Board Pcb


Types of devices

An operating prototyped circuit breadboard incorporating four DIP ICs, a DIP LED bargraph display (upper left), and a DIP 7-segment LED display (lower left).

DIPs are commonly used for integrated circuits (ICs). Other devices in DIP packages include resistor networks, DIP switches, LED segmented and bargraph displays, and electromechanical relays.

DIP connector plugs for ribbon cables are common in computers and other electronic equipment.

Dallas Semiconductor manufactured integrated DIP real-time clock (RTC) modules which contained an IC chip and a non-replaceable 10-year lithium battery.

DIP header blocks on to which discrete components could be soldered were used where groups of components needed to be easily removed, for configuration changes, optional features or calibration.


The original dual-in-line package was invented by Bryant "Buck" Rogers in 1964 while working for Fairchild Semiconductor. The first devices had 14 pins and looked much like they do today. The rectangular shape allowed integrated circuits to be packaged more densely than previous round packages. The package was well-suited to automated assembly equipment; a printed circuit board could be populated with scores or hundreds of ICs, then all the components on the circuit board could be soldered at one time on a wave soldering machine and passed on to automated testing machines, with very little human labor required. DIP packages were still large with respect to the integrated circuits within them. By the end of the 20th century, surface-mount packages allowed further reduction in the size and weight of systems. DIP chips are still popular for circuit prototyping on a breadboard because of how easily they can be inserted and utilized there.

DIPs were the mainstream of the microelectronics industry in the 1970s and 80s. Their use has declined in the first decade of the 21st century due to the emerging new surface-mount technology (SMT) packages such as plastic leaded chip carrier (PLCC) and small-outline integrated circuit (SOIC), though DIPs continued in extensive use through the 1990s, and still continue to be used substantially as the year 2011 passes. Because some modern chips are available only in surface-mount package types, a number of companies sell various prototyping adapters to allow those SMT devices to be used like DIP devices with through-hole breadboards and soldered prototyping boards (such as stripboard and perfboard). (SMT can pose quite a problem, at least an inconvenience, for prototyping in general; most of the characteristics of SMT that are advantages for mass production are difficulties for prototyping.)

For programmable devices like EPROMs and GALs, DIPs remained popular for many years due to their easy handling with external programming circuitry (i.e., the DIP devices could be simply plugged into a socket on the programming device.) However, with In-System Programming (ISP) technology now state of the art, this advantage of DIPs is rapidly losing importance as well.

Through the 1990s, devices with fewer than 20 leads were manufactured in a DIP format in addition to the newer formats. Since about 2000, newer devices are often unavailable in the DIP format.

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