High Quality-circuit Board Design Online

- Dec 23, 2016-

High Quality-circuit Board Design Online

Laminates

Laminates are manufactured by curing under pressure and temperature layers of cloth or paper with thermoset resin to form an integral final piece of uniform thickness. The size can be up to 4 by 8 feet (1.2 by 2.4 m) in width and length. Varying cloth weaves (threads per inch or cm), cloth thickness, and resin percentage are used to achieve the desired final thickness and dielectric characteristics. Available standard laminate thickness are listed in

Table 1
Standard laminate thickness per ANSI/IPC-D-275
IPC laminate
number
Thickness
in inches
Thickness
in millimeters
 IPC laminate
number
Thickness
in inches
Thickness
in millimeters
L10.0020.05
L90.0280.70
L20.0040.10
L100.0350.90
L30.0060.15
L110.0431.10
L40.0080.20
L120.0551.40
L50.0100.25
L130.0591.50
L60.0120.30
L140.0751.90
L70.0160.40
L150.0902.30
L80.0200.50
L160.1223.10

Notes:

  1. Jump up^ Although this specification has been superseded and the new specification does not list standard sizes, these are still the most common sizes stocked and ordered for manufacturer.

The cloth or fiber material used, resin material, and the cloth to resin ratio determine the laminate's type designation (FR-4, CEM-1, G-10, etc.) and therefore the characteristics of the laminate produced. Important characteristics are the level to which the laminate is fire retardant, the dielectric constant (er), the loss factor (tδ), the tensile strength, the shear strength, the glass transition temperature (Tg), and the Z-axis expansion coefficient (how much the thickness changes with temperature).

There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known pre-preg materials used in the PCB industry are FR-2 (phenolic cotton paper), FR-3 (cotton paper and epoxy), FR-4 (woven glass and epoxy), FR-5 (woven glass and epoxy), FR-6 (matte glass and polyester), G-10 (woven glass and epoxy), CEM-1 (cotton paper and epoxy), CEM-2 (cotton paper and epoxy), CEM-3 (non-woven glass and epoxy), CEM-4 (woven glass and epoxy), CEM-5 (woven glass and polyester). Thermal expansion is an important consideration especially with ball grid array (BGA) and naked die technologies, and glass fiber offers the best dimensional stability.

FR-4 is by far the most common material used today. The board with copper on it is called "copper-clad laminate".

With decreasing size of board features and increasing frequencies, small nonhomogeneities like uneven distribution of fiberglass or other filler, thickness variations, and bubbles in the resin matrix, and the associated local variations in the dielectric constant, are gaining importance.



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