Plated Through Hole Was An Important
Plated through hole was an important process among the printed circuit board fabrication. Traditionally we used the basic epoxy as the resin material to the copper clad laminate. Becausenwhich possessed the many applicational problems, it should be improved immediately. On this study we used the high performance epoxy to instead of the basic epoxy as the resin material for the copper clad laminate. According to the experimental results, we found that the morphology of the deposit layer was quite well, the thermal property of which could correspond with the practical requirements. So it was an excellent resin material for the copper clad laminate, we would use which to the printed circuit board fabrication successfully.