Stained Glass Soldering-Custom Design Circuit Board Electronic Pcb​

- Feb 08, 2017-

Stained Glass Soldering-Custom Design Circuit

Board Electronic Pcb

Stained glass soldering

Historically, stained glass soldering tips were copper, heated by being placed in a charcoal-burning brazier. Multiple tips were used; when one tip cooled down from use, it was placed back in the brazier of charcoal and the next tip was used.

More recently, electrically heated soldering irons are used. These are heated by a coil or ceramic heating element inside the tip of the iron. Different power ratings are available, and temperature can be controlled electronically. These characteristics allow longer beads to be run without interrupting the work to change tips. Soldering irons designed for electronic use are often effective though they are sometimes underpowered for the heavy copper and lead came used in stained glass work. Oleic acid is the classic flux material that has been used to improve solderability.

Tiffany-type stained glass is made by gluing copper foil around the edges of the pieces of glass and then soldering them together. This method makes it possible to create three-dimensional stained glass pieces.

Active soldering

Flux-less soldering with aid of conventional soldering iron, ultrasonic soldering iron or specialized solder pot and active solder that contains an active element, most often Ti, Zr or Cr. The active elements, owing to mechanical activation, react with the surface of the materials generally considered as difficult to solder without premetallization. The active solders can be protected against excessive oxidation of their active element by addition of rare earth elements with higher affinity to oxygen (typically Ce, La). Another common additive is Ga – usually introduced as a wetting promoter. Mechanical activation, needed for active soldering, can be performed by brushing (for example with use of stainless wire brush or steel spatula) or ultrasonic vibration (20 – 60 kHz). Active soldering has been shown to effectively bond ceramics, aluminium, titanium, silicon,graphite and carbon nanotube based structures at temperatures lower than 450 °C or use of protective atmosphere.

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