Standards Development And Activities-Circuit
Board Electronic Pcb
Printed electronics are in use or under consideration for:
Radio-frequency identification (RFID) tags
Display and visual effects
Norwegian company ThinFilm successfully demonstrated roll-to-roll printed organic memory in 2009.
Standards development and activities
Technical standards and roadmapping initiatives are intended to facilitate value chain development (for sharing of product specifications, characterization standards, etc.) This strategy of standards development mirrors the approach used by silicon-based electronics over the past 50 years. Initiatives include:
The IEEE Standards Association has published IEEE 1620-2004 and IEEE 1620.1-2006.
Similar to the well-established International Technology Roadmap for Semiconductors (ITRS), the International Electronics Manufacturing Initiative (iNEMI) has published a roadmap for printed and other organic electronics.
IPC—Association Connecting Electronics Industries has published three standards for printed electronics. All three have been published in cooperation with the Japan Electronic Packaging and Circuits Association (JPCA):
IPC/JPCA-4921, Requirements for Printed Electronics Base Materials
IPC/JPCA-4591, Requirements for Printed Electronics Functional Conductive Materials
IPC/JPCA-2291, Design Guideline for Printed Electronics
These standards, and others in development, are part of IPC’s Printed Electronics Initiative.
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