Thermal Profiling-Custom Design Circuit Board Electronic Pcb​

- Feb 06, 2017-

Thermal Profiling-Custom Design Circuit Board

Electronic Pcb

Thermal profiling

thermal profile is a complex set of time-temperature data typically associated with the measurement of thermal temperatures in an oven (ex: reflow oven). The thermal profile is often measured along a variety of dimensions such as slope, soak, time above liquidus (TAL), and peak.

A thermal profile can be ranked on how it fits in a process window (the specification or tolerance limit). Raw temperature values are normalized in terms of a percentage relative to both the process mean and the window limits. The center of the process window is defined as zero, and the extreme edges of the process window are ±99%. A Process Window Index (PWI) greater than or equal to 100% indicates the profile is outside of the process limitations. A PWI of 99% indicates that the profile is within process limitations, but runs at the edge of the process window.  For example, if the process mean is set at 200 °C with the process window calibrated at 180 °C and 220 °C respectively, then a measured value of 188 °C translates to a process window index of −60%.

The method is used in a variety of industrial and laboratory processes,  including electronic component assembly, optoelectronics, optics, biochemical engineering,  food science, decontamination of hazardous wastes, and geochemical analysis.

Professional Manufactur Custom Design Circuit Board Electronic Pcb

Previous:Thermal Profiling-Soldering Of Electronic Products-circuit Board Pcb Next:Wave Soldering- Process-Fluxing-Custom Design Circuit Board Pcb​