Thermal Profiling-Soldering Of Electronic
Products-circuit Board Pcb
Soldering of electronic products
One of the major uses of this method is soldering of electronic assemblies. There are two main types of profiles used today: The Ramp-Soak-Spike (RSS) and the Ramp to Spike (RTS). In modern systems, quality management practices in manufacturing industries have produced automatic process algorithms such as PWI, where soldering ovens come preloaded with extensive electronics and programmable inputs to define and refine process specifications. By using algorithms such as PWI, engineers can calibrate and customize parameters to achieve minimum process variance and a near zero defect rate.
In soldering, a thermal profile is a complex set of time-temperature values for a variety of process dimensions such as slope, soak, TAL, and peak. Solder paste contains a mix of metal, flux, and solvents that aid in the phase change of the paste from semi-solid, to liquid to vapor; and the metal from solid to liquid. For an effective soldering process, soldering must be carried out under carefully calibrated conditions in a reflow oven. Convection Reflow Oven Detailed Description
There are two main profile types used today in soldering:
The Ramp-Soak-Spike (RSS)
Ramp to Spike (RTS)