Thermal Profiling-Soldering Of Electronic Products-Ramp-to-Spike-pcb

- Feb 06, 2017-

Thermal Profiling-Soldering Of Electronic

Products-Ramp-to-Spike-pcb

Soldering of electronic products

One of the major uses of this method is soldering of electronic assemblies. There are two main types of profiles used today: The Ramp-Soak-Spike (RSS) and the Ramp to Spike (RTS). In modern systems, quality management practices in manufacturing industries have produced automatic process algorithms such as PWI, where soldering ovens come preloaded with extensive electronics and programmable inputs to define and refine process specifications. By using algorithms such as PWI, engineers can calibrate and customize parameters to achieve minimum process variance and a near zero defect rate.

Ramp-to-Spike

Ramp-To-Spike characteristics

The Ramp to Spike (RTS) profile is almost a linear graph, starting at the entrance of the process and ending at the peak segment, with a greater Δt (change in temperature) in the cooling segment. While the Ramp-Soak-Spike (RSS) allows for about 4 °C/s, the requirements of the RTS is about 1–2 °C/s. These values depend on the solder paste specifications. The RTS soak period is part of the ramp and is not as easily distinguishable as in RSS. The soak is controlled primarily by the conveyor speed. The peak of the RTS profile is the endpoint of the linear ramp to the peak segment of the profile. The same considerations about defects in an RSS profile also apply to an RTS profile.[9]:18

When the PCB enters the cooling segment, the negative slope generally is steeper than the rising slope.


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