Thermal Profiling-Soldering Of Electronic
Virtual profiling is a method of creating profiles without attaching the thermocouples (TCs) or having to physically instrument a PCB each and every time a profile is run for the same production board. All the typical profile data such as slope, soak, TAL, etc., that are measured by instrumented profiles are gathered by using virtual profiles. The benefits of not having attached TCs surpass the convenience of not having to instrument a PCB every time a new profile is needed.
Virtual profiles are created automatically, for both reflow or wave solder machines. An initial recipe setup is required for modeling purposes, but once completed, profiling can be made virtual. As the system is automatic, profiles can be generated periodically or continuously for each and every assembly. SPC charts along with CpK can be used as an aid when collecting a mountain of process-related data. Automated profiling systems continuously monitor the process and create profiles for each assembly. As barcoding becomes more common with both reflow and wave processes, the two technologies can be combined for profiling traceability, allowing each generated profile to be searchable by barcode. This is useful when an assembly is questioned at some time in the future. As a profile is created for each assembly, a quick search using the PCB’s barcode can pull up the profile in question and provide evidence that the component was processed in spec. Additionally, tighter process control can be achieved when combining automated profiling with barcoding, such as confirming that the correct process has been input by the operator before launching a production run.