Multilayer PCB printed circuit board fabrication process Service

Multilayer PCB printed circuit board fabrication process Service

The printed circuit board basics, as a printed board with three or more conductive pattern layers and insulation materials, which has longer service life for use and there is no special need of maintaining.

Product Details


Product Feature

The printed circuit board basics is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components after the printed board is used for electronic equipment. Due to the consistency of similar printed boards, errors in manual wiring can be avoided, and automatic insertion or placement of electronic components, automatic soldering, and automatic detection can be guaranteed, thus to ensure high and reliable performance.


Product Description

The printed circuit board basics, as a printed board with three or more conductive pattern layers and insulation materials, which has longer service life for use and there is no special need of maintaining. Equipped with excellent electronic information technology, our printed circuit board basics has the advantage of high speed, multifunction, large capacity, small size, thinness, and light weight. Due to the proper size and compact design, it is really easy for installation.


Multilayer pcb printed circuit board fabrication process Service

Multilayer pcb printed circuit board fabrication process Service

Multilayer pcb printed circuit board fabrication process Service

Multilayer pcb printed circuit board fabrication process Service


PCB Assembly And Purchase PCB Board Components Our Manufacturer Capability:

Item

Manufacture Capability

Material

FR-4 / Hi Tg FR-4 / Taconic / Rogers / F4BK /CEM-3 / Aluminium / other Metal based

Layer No.

1-20

Finished Board thickness

0.2 mm-3.8mm’(8 mil-150 mil)

Board Thickness Tolerance

±10%

Cooper thickness

0.5 OZ-11OZ (18 um-385 um)

Copper Plating Hole

18-40 um

Impedance Control

±10%

Warp&Twist

0.70%

Peelable

0.012"(0.3mm)-0.02’(0.5mm)

Images

Min Trace Width (a)

0.1mm (4 mil)

Min Space Width (b)

0.1mm (4 mil)

Min Annular Ring

0.1mm (4 mil)

SMD Pitch (a)

0.2 mm(8 mil)

BGA Pitch (b)

0.2 mm (8 mil)

Solder Mask

Min Solder Mask Dam (a)

0.0635 mm (2.5mil)

Soldermask Clearance (b)

0.1mm (4 mil)

Min SMT Pad spacing (c)

0.1mm (4 mil)

Solder Mask Thickness

0.0007"(0.018mm)

Holes

Min Hole size (CNC)

0.2 mm (8 mil)

Min Punch Hole Size

0.9 mm (35 mil)

Hole Size Tol (+/-)

PTH:±0.075mm;NPTH: ±0.05mm

Hole Position Tol

±0.075mm

Plating

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold

Nickel  3-7um  Au:1-5u'

OSP

0.2-0.5um

Outline

Panel Outline Tol (+/-)

CNC: ±0.125mm, Punching: ±0.15mm

Beveling

30°45°

Gold Finger angle

15° 30° 45° 60°

Certificate

ROHS,  ISO9001:2008,  SGS,  UL certificate


Our Team:

Multilayer pcb printed circuit board fabrication process Service


Certificate:

Multilayer pcb printed circuit board fabrication process Service


Package for pcb assembly

Multilayer pcb printed circuit board fabrication process Service


PCB Assembly And Purchase PCB Board Components Application:

Multilayer pcb printed circuit board fabrication process Service


Multilayer FR4 PCB Circuit Boards Pcb Assembly Service



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